Related papers: Power aware physical model for 3d IC's
Virtually all electronic systems try to optimize a fundamental trade-off between higher performance and lower power consumption. The latter becomes critical in mobile computing systems, such as smartphones, which rely on passive cooling.…
Design of effective micro cooling systems to address the challenges of ever increasing heat flux from microdevices requires deep examination of real time problems and has been tackled in depth. The most common and apparently misleading…
Deploying distributed renewable energy at the demand side is an important measure to implement a sustainable society. However, the massive small solar and wind generation units are beyond the control of a central operator. To encourage…
Quantum dots (QDs) are applied in a variety of fields ranging from photovoltaics to biomedical imaging. Even the smallest QDs present a complicated potential energy surface characterized by a large set of stationary points. Each local…
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…
Advances in nanosheet technologies have significantly increased power densities, exacerbating thermal management challenges in 2.5D/3D chiplet-based Systems-in-Package (SiP). While traditional thermal analyses often employ uniform power…
We propose in this paper to study the energy-, thermal- and performance-aware resource management in heterogeneous datacenters. Witnessing the continuous development of heterogeneity in datacenters, we are confronted with their different…
Modern multicore System-on-Chips (SoCs) feature hardware monitoring mechanisms that measure total power consumption. However, these aggregate measurements are often insufficient for fine-grained thermal and power management. This paper…
A mathematical model of the heat process in one-dimensional domain governed by a cylindrical heat equation with a heat source on the axis $z=0$ and nonlinear thermal coefficients is considered. The developed model is particularly applicable…
Power consumption is a major concern in data centers and HPC applications, with GPUs typically accounting for more than half of system power usage. While accurate power measurement tools are crucial for optimizing the energy efficiency of…
Sustainability in high performance computing (HPC) is a major challenge not only for HPC centers and their users, but also for society as the climate goals become stricter. A lot of effort went into reducing the energy consumption of…
Energy has been increasingly generated or collected by different entities on the power grid (e.g., universities, hospitals and householdes) via solar panels, wind turbines or local generators in the past decade. With local energy, such…
This paper proposes a learning-based model predictive control (MPC) approach for the thermal control of a four-zone smart building. The objectives are to minimize energy consumption and maintain the residents' comfort. The proposed control…
It is known that 3D-ICs suffer from hot spot temperatures that can reach thousands of degrees, if they are not cooled to reasonable operating temperatures. The problem of hot spots is not limited to the high temperatures of the IC; thermal…
Equilibrium finite temperature observables of a CFT can be described by a local effective action for background fields -- a "thermal effective action." This effective action determines the asymptotic density of states of a CFT as a detailed…
Shockwave interactions with material microstructure localizes energy into hotspots, which act as nucleation sites for complex processes such as phase transformations and chemical reactions. To date, hotspots have been described via their…
Multi-Processor Systems-on-Chip (MPSoC) can deliver high performance needed in many industrial domains, including aerospace. However, their high power consumption, combined with avionics safety standards, brings new thermal management…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
Geothermal Heat Pump (GHP) systems are heating and cooling systems that use the ground as the temperature exchange medium. GHP systems are becoming more and more popular in recent years due to their high efficiency. Conventional control…
The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps with high computational efficiency. Traditional compact…