Related papers: Interlayer coupling enhanced by the interface roug…
Multi-layer graphene on the carbon face of silicon carbide is an intriguing electronic system which typically consists of a stack of ten or more layers. Rotational stacking faults in this system dramatically reduce inter-layer coherence. In…
We estimate the strength of interaction-enhanced coherence between two graphene or topological insulator surface-state layers by solving imaginary-axis gap equations in the random phase approximation. Using a self-consistent treatment of…
Signatures of unconventional superconductivity have been reported in a wide range of van der Waals (vdW) materials. However, their microscopic origin remains unclear due to competing electronic orders, strong spin-orbit coupling, and…
We propose that geometric curvature and torsion may be used to probe the quality of an uncompensated antiferromagnetic interface, using the proximity effect. We study a helix of antiferromagnetic wire coupled to a conventional…
Heterostructures between two-dimensional quantum spin Hall insulators (QSHI) and superconducting materials can allow for the presence of Majorana Fermions at their conducting edge states. Although a strong interface hybridization helps…
We theoretically investigate the RKKY exchange coupling between two ferromagnets (FM) separated by a thin topological insulator film (TI). We find an unusual dependence of the RKKY exchange coupling on the TI thickness ($t_{TI}$). First,…
Diverse interlayer tunability of physical properties of two-dimensional layers mostly lies in the covalent-like quasi-bonding that is significant in electronic structures but rather weak for energetics. Such characteristics result in…
Orbital degeneracy of the electronic conduction band edge in silicon is a potential roadblock to the storage and manipulation of quantum information involving the electronic spin degree of freedom in this host material. This difficulty may…
The roughness of crack interfaces is reported in quasistatic fracture, using an elastic network of beams with random breaking thresholds. For strong disorders we obtain 0.86(3) for the roughness exponent, a result which is very different…
Based on ab initio calculations, we study the effect of intercalating twisted bilayer graphene with carbon. Surprisingly, we find that the intercalant pulls the atoms in the two layers closer together locally when placed in certain regions…
We report on a resonant soft X-ray spectroscopy study of the electronic and magnetic structure of the cuprate-manganite interface. Polarized X-ray spectroscopy measurements taken at the Cu L edge reveal up to a five-fold increase in the…
We observed a magnetic interfacial effect due to the coupling between two interfaces of different materials. The interface is compoust of an antiferromagnetic and other quasi-ferromagnetic material. This effect we measured through the…
We analyze intermittence and roughening of an elastic interface or domain wall pinned in a periodic potential, in the presence of random-bond disorder in (1+1) and (2+1) dimensions. Though the ensemble average behavior is smooth, the…
We report local probe investigations of the magnetic interaction between BiFeO3 films and a ferromagnetic Co0.9Fe0.1 layer. Within the constraints of intralayer exchange coupling in the Co0.9Fe0.1, the multiferroic imprint in the…
We present an introduction to modern theories of interfacial fluctuations and the associated interfacial parameters: surface tension and surface stiffness, as well as their interpretation within the capillary wave model. Transfer matrix…
A microscopic calculation of the perpendicular current in doped multiple quantum wells is presented. Interface roughness is shown to affect the resonant transitions as well as to cause a nonresonant background current. The theoretical…
We theoretically find that the second-order topological insulator, i.e., corner states, can be engineered by coupling two copies of two-dimensional $\mathbb{Z}_2$ topological insulators with opposite spin-helicities. As concrete examples,…
In order to explore why the multi-layered cuprates have such high Tc's, we have examined various inter-layer processes. Since the inter-layer one-electron hopping has little effects on the band structure, we turn to the inter-layer pair…
In recent years, interfacial fracture becomes one of the most important problems in the assessment of reliability of electronics packaging. Especially, underfill resin is used with solder joints in flip chip packaging for preventing the…
The change in the electronic structure of layered Cu$_{x}$IrTe$_{2}$ has been characterized by transport and spectroscopic measurements, combined with first-principles calculations. The Cu-intercalation suppresses the monoclinic distortion,…