Related papers: Micro Embossing of Ceramic Green Substrates for Mi…
Mesa- and trench-patterned surfaces of 4H-SiC(0001) 4{\textdegree}off wafers were structured in macrosteps using Si melting in a SiC-Si-SiC sandwich configuration. Si spreading difficulties were observed in the case of trench-patterned…
The demand for higher resolution displays drives the demand for smaller pixels. Displays show a trend of doubling the pixel number every 4 years and doubling the pixel per inch (PPI) every 6 years. As the prospective candidate for…
Spatial control of wettability is key to many applications of microfluidic devices, ranging from double emulsion generation to localized cell adhesion. A number of techniques, often based on masking, have been developed to produce…
Ice templating, also known as freeze casting, is a popular shaping route for macroporous materials. Over the past 15 years, it has been widely applied to various classes of materials, and in particular ceramics. Many formulation and process…
Micro-transfer printing is an assembly technology that enables large-scale integration of diverse materials and components from micro- to nano-scale. However, traditional micro-transfer printing technologies lack dynamic selectivity,…
The low thermal conductivity of silicon nanostructures, with respect to bulk silicon, opens excellent possibilities for thermoelectric applications because it will enable the use of silicon for the high efficient direct conversion of wasted…
The COVID-19 pandemic has shown the urgent need for the development of efficient, durable, reusable and recyclable filtration media for the deep-submicron size range. Here we demonstrate a multifunctional filtration platform using porous…
A characteristic mode (CM) method that relies on a global multi-trace formulation (MTF) of surface integral equations is proposed to compute the modes and the resonance frequencies of microstrip patch antennas with finite dielectric…
Micromechanical constitutive parameters are important for many engineering materials, typically in microelectronic applications and material design. Their accurate identification poses a three-fold experimental challenge: (i) deformation of…
The design of low-profile linear microstrip arrays with wide-band spatial filtering capabilities is dealt with. An innovative architecture, leveraging the angular selectivity of offset stacked patch (OSP) radiators, is proposed to implement…
Micrometer width and nanometer thick wires with different shapes were produced $\approx 3~\upmu$m below the surface of a diamond crystal using a microbeam of He$^+$ ions with 1.8~MeV energy. Initial samples are amorphous and after annealing…
Large-scale microfluidic microsystems with complex three-dimensional (3D) configurations are highly in demand by both fundamental research and industrial application, holding the potentials for fostering a wide range of innovative…
Gaseous layers (plastrons) trapped on the surfaces of immersed hydrophobic surfaces are critical for their function. Fibrillar morphologies offer a natural pathway, yet they are limited to a narrow range of liquid-surface systems and are…
Inductance of superconducting thin-film inductors and structures with linewidth down to 250 nm has been experimentally evaluated. The inductors include various striplines and microstrips, their 90-degree bends and meanders, interlayer vias,…
The use of graphene in a form of discontinuous flakes in polymer composites limits the full exploitation of the unique properties of graphene, thus requiring high filler loadings for achieving - for example - satisfactory electrical and…
Nanoindentation is vital for probing mechanical properties, yet traditional grid-based workflows are inefficient for targeting specific microstructural features. We present an automated nanoindentation framework that integrates machine…
Over the last decade advances in high temperature superconducting (HTS) materials have generated a renewed optimism in the use of this technology in future high-power applications including motors, generators, and power transmission. The…
A simple and fast process for micro-electromechanical (MEM) resonators with deep sub-micron transduction gaps in thin SOI is presented in this paper. Thin SOI wafers are important for advanced CMOS technology and thus are evaluated as…
Honeycomb-like microstructures have been shown to exhibit local elastic buckling under compression, with three possible geometric buckling modes, or pattern transformations. The individual pattern transformations, and consequently also…
Texture in dense or porous ceramics can enhance their functional and structural properties. Current methods for texturation employ anisotropic particles as starting powders and processes that drive their orientation into specific…