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The lithium metal-solid-state electrolyte interface plays a critical role in the performance of solid-state batteries. However, operando characterization of the buried interface morphology in solid-state cells is particularly difficult…

We will describe the thermal performance of power semiconductor module, which consists of hetero-junction bipolar transistors (HBTs), for mobile communication systems. We calculate the thermal resistance between the HBT fingers and the…

Materials Science · Physics 2007-09-13 Y. Osone

The Gamma-Ray Energy Tracking Array (GRETA) is a next-generation gamma-ray spectrometer designed to push the frontiers of nuclear structure and astrophysics experiment. Its high sensitivity is enabled by high-precision localization of…

Instrumentation and Detectors · Physics 2025-12-16 Arin Manohar , Mario Cromaz , Christopher Campbell , Heather Crawford , Marco Salathe

Metal meshes have emerged as an important class of flexible transparent electrodes. We report on the characteristics of a new class of asymmetric meshes, tiled using a recently-discovered family of pentagons. Micron-scale meshes were…

Mesoscale and Nanoscale Physics · Physics 2016-11-10 Daniel Lordan , Micheal Burke , Mary Manning , Andreas Amann , Dan O'Connell , Richard Murphy , Colin Lyons , Aidan J. Quinn

The development of lightweight flex PCBs and nanowire-based thermal interfaces for low-mass, high-performance detector modules are presented. A novel manufacturing approach targeting flex circuits with double-sided pad access, assembled…

Instrumentation and Detectors · Physics 2026-01-27 Abhishek Sharma , Atul Gorane , Petra Riedler , Julian Weick

Seams are areas of overlapping fabric formed by stitching two or more pieces of fabric together in the cut-and-sew apparel manufacturing process. In SeamPose, we repurposed seams as capacitive sensors in a shirt for continuous upper-body…

We present measurements of the low temperature thermal conductivity for materials useful in the construction of cryogenic supports for scientific instrumentation and in the fabrication of flat flexible cryogenic cabling. The materials we…

Instrumentation and Detectors · Physics 2019-01-11 M. Daal , N. Zobrist , N. Kellaris , B. Sadoulet , M. Robertson

Tactile sensing is used in robotics to obtain real-time feedback during physical interactions. Fine object manipulation is a robotic application that benefits from a high density of sensors to accurately estimate object pose, whereas a low…

Robotics · Computer Science 2024-12-03 Carson Kohlbrenner , Caleb Escobedo , Nataliya Nechyporenko , Alessandro Roncone

Non-Hermitian systems offer significant advantages in sensor design, especially at the exceptional points. However, the extreme sensitivity near these points poses great challenges due to fabrication errors and system noises, which degrade…

Thermal FEM (Finite Element Method) simulations can be used to predict the thermal behavior of power semiconductors in application. Most power semiconductors are made of silicon. Silicon thermal material properties are significantly…

General Physics · Physics 2008-01-08 V. Kosel , R. Sleik , M. Glavanovics

This paper presents a numerical simulation and experimental results of a one-dimensional thermal inclinometer with the cavity filled of gas and liquid. The sensor principle consists of one heating resistor placed between two detectors. When…

Other Computer Science · Computer Science 2008-12-18 N. Crespy , J. Courteaud , P. Combette , P. Temple Boyer , A. Giani , A. Foucaran

Thermoacoustic Refrigerators use acoustic power for generating cold temperatures. Development of refrigerators based on the thermoacoustic technology is a novel solution to the present day need of cooling, without causing environmental…

Instrumentation and Detectors · Physics 2016-10-04 Ram C. Dhuley

In this work, we report the fabrication of a high temperature measurement setup to measure Figure of merit (ZT). This setup facilitates the simultaneous measurement of Seebeck coefficient ({\alpha}), thermal conductivity (\kappa), and…

Instrumentation and Detectors · Physics 2018-01-09 Ashutosh Patel , Sudhir K. Pandey

The reduction of the thermal conductivity in nanostructures opens up the possibility of exploiting for thermoelectric purposes also materials such as silicon, which are cheap, available and sustainable but with a high thermal conductivity…

Mesoscale and Nanoscale Physics · Physics 2018-02-14 G. Pennelli , E. Dimaggio , M. Macucci

This work deals with a practical everyday problem: stable object placement on flat surfaces starting from unknown initial poses. Common object-placing approaches require either complete scene specifications or extrinsic sensor measurements,…

High-throughput computational and experimental design of materials aided by machine learning have become an increasingly important field in material science. This area of research has emerged in leaps and bounds in the thermal sciences, in…

Materials Science · Physics 2019-06-17 Hang Zhang , Kedar Hippalgaonkar , Tonio Buonassisi , Ole M. Løvvik , Espen Sagvolden , Ding Ding

A simple means of detecting and spatially mapping volatile and nonvolatile conductive filaments in metal/oxide/metal cross-point devices is introduced and its application demonstrated. The technique is based on thermal discolouration of a…

Applied Physics · Physics 2018-11-30 Shimul Kanti Nath , Sanjoy Kumar Nandi , Shuai Li , Robert Glen Elliman

This paper presents a novel fabric-based thermal-haptic interface for virtual reality and teleoperation. It integrates pneumatic actuation and conductive fabric with an innovative ultra-lightweight design, achieving only 2~g for each finger…

Robotics · Computer Science 2026-03-02 Rui Chen , Domenico Chiaradia , Antonio Frisoli , Daniele Leonardis

Distributed temperature sensors (DTS) measure temperatures by means of optical fibers. Those optoelectronic devices provide a continuous profile of the temperature distribution along the cable. Initiated in the 1980s, DTS systems have…

Instrumentation and Detectors · Physics 2015-03-24 A. Ukil , H. Braendle , P. Krippner

Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stacked) and lateral arrangement. In our present study we show…

Materials Science · Physics 2007-09-13 A. Poppe , Y. Zhang , J. Wilson , G. Farkas , P. Szabo , J. Parry
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