Related papers: New Reliability Assessment Method for Solder Joint…
The recent development of electric and electronic devices has been remarkable. The miniaturization of electronic devices and high integration are progressing by advances in mounting technology. As a result, the reliability of fatigue life…
This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject…
In recent years, interfacial fracture becomes one of the most important problems in the assessment of reliability of electronics packaging. Especially, underfill resin is used with solder joints in flip chip packaging for preventing the…
Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid…
Mechanical compliance is a key design parameter for dynamic contact-rich manipulation, affecting task success and safety robustness over contact geometry variation. Design of soft robotic structures, such as compliant fingers, requires…
Effects of radiation on electronic circuits used in extra-terrestrial applications and radiation prone environments need to be corrected. Since FPGAs offer flexibility, the effects of radiation on them need to be studied and robust methods…
Mechanical reliability plays an outsized role in determining the durability of flexible electronic devices because of the significant mechanical stresses they can experience during manufacturing and operation. These devices are typically…
Woven shell structures are beneficial for applications requiring lightweight, damage resilience, and design tunability, such as in wearable devices, soft robotics, and aerospace systems. A fundamental component of woven structures is the…
The aim of this paper is to show through a simple assembly a method of tolerancing analysis (coherent with GPS) developed at LM\'ecA and based on the model of clearance and deviation domains. Tolerancing is an important step in the product…
The design and operation of apparatus for measurements of in-beam hyperfine interactions and nuclear excited-state $g$ factors is described. This apparatus enables a magnetic field of about 0.1 tesla to be applied to the target and the…
Robotic disassembly involves contact-rich interactions in which successful manipulation depends not only on geometric alignment but also on force-dependent state transitions. While vision-based policies perform well in structured settings,…
This paper presents a computationally efficient method for the optimal design of silica aerogel porous material systems, balancing thermal insulation performance with mechanical stability under stress concentrations. The proposed approach…
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design…
Component failure due to cold dwell fatigue of titanium and its alloys is a long-standing problem which has significant safety and economic implications to the aviation industry. This can be addressed by understanding the governing…
Changes are inherent in software development, often increasing developers' perception of instability. Understanding the relationship between human factors and Software Engineering processes is crucial to mitigating and preventing issues.…
In this paper, electrothermal field phenomena in electronic components are considered. This coupling is tackled by multiphysical field simulations using the Finite Integration Technique (FIT). In particular, the design of bonding wires with…
Fatigue failure is ubiquitous in engineering applications. While the total fatigue life is critical to understanding a component's operational life, for safety, regulatory compliance, and predictive maintenance, the characterization of…
Complex morphologies and microstructures that emerge during materials growth and solidification are often determined by both equilibrium and kinetic properties of the interface and their crystalline anisotropies. However limited knowledge…
During electrostatic bonding, also known as anodic bonding, silicon is bonded to glass by applying an external voltage and simultaneous heating to temperatures of 200...450 $\deg$C. While cooling to working temperature after bonding…
The influence of electrical and thermal contact resistance on the efficiency of a segmented thermoelectric generator is investigated. We consider 12 different segmented $p$-legs and 12 different segmented $n$-legs, using 8 different…