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We present mechanical measurements performed at low temperatures on cantilever-based microelectro-mechanicalstructures(MEMS) coated with a metallic layer. Two very different coatings are presented in order to illustrate the capabilities of…
Self-assembled nano and micro-structures, particularly those capable of responsive erasure and regeneration, have garnered significant interest for their applications in smart photonics and electronics. However, current techniques for…
Ultrathin microscale resistive thermometers are of key value to many applications. Here we have fabricated a laser machined 50 ${\mu}$m wide and 50 nm thick serpentine Pt thin film sensor capable of sensing temperatures up to 650 ${^\circ}$…
The prospect of building a quantum information processor underlies many recent advances ion trap fabrication techniques. Potentially, a quantum computer could be constructed from a large array of interconnected ion traps. We report on a…
Multilayered ceramic substrates with embedded micro patterns are becoming increasingly important, for example, in harsh environment electronics and microfluidic devices. Fabrication of these embedded micro patterns, such as micro channels,…
Being able to combine different materials allows taking advantage of different properties and device engineering that cannot be found or exploited within a single material system. In quantum nano-photonics, one might want to increase the…
Despite several decades of development, microfluidics lacks a sealing material that can be readily fabricated, leak-tight under high liquid water pressure, stable over a long time, and vacuum compatible. In this paper, we report the…
We perform numerical and experimental studies on the melting process of thin films initiated by a small hole. The presence of a non-trivial capillary surface, namely the liquid/air interface, leads to a few counter-intuitive results: (1)…
Optical cavity cooling of mechanical resonators has recently become a research frontier. The cooling has been realized with a metal-coated silicon microlever via photo-thermal force and subsequently with dielectric objects via radiation…
The solidification behavior of a eutectic AlCu specimen is investigated via in situ scanning transmission electron microscope (STEM) experiments. Solidification conditions are varied by imposing various cooling conditions via a…
We have achieved stimulated laser cooling of thermal rubidium atomic beams on a silicon chip. Following pre-collimation via a silicon microchannel array, we perform beam brightening via a blue-detuned optical molasses. Owing to the small…
We demonstrate significant cooling of electrons in a nanostructure below 10 mK by demagnetisation of thin-film copper on a silicon chip. Our approach overcomes the typical bottleneck of weak electron-phonon scattering by coupling the…
5$\mu$m thick SmCo films were deposited onto Si substrates using triode sputtering. A study of the influence of deposition temperature (Tdep <= 600 degrees C) on the structural, magnetic and mechanical properties has shown that optimum…
We demonstrate a novel atom chip trapping system that allows the placement and high-resolution imaging of ultracold atoms within microns from any <100 um-thin, UHV-compatible material, while also allowing sample exchange with minimal…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
The ability to make controlled patterns of magnetic structures within a nonmagnetic background is essential for several types of existing and proposed technologies. Such patterns provide the foundation of magnetic memory and logic devices,…
The combination of metasurfaces with chalcogenide phase-change materials is a highly promising route towards the development of multifunctional and reconfigurable nanophotonic devices. However, their transition into real-world devices is…
This article introduces a thin-film thermocouple temperature sensor with symmetrical electrode structure. It uses PI film as a flexible substrate. Cu film and CuNi film made by MEMS manufacturing process as positive and negative electrodes.…
Here, we report a process of metallic sealing using small well-separated Ag nanorods; the process is at room temperature under a small mechanical pressure of 9.0 MPa, and also in ambient. The metallic seals have an air leak rate of 1.1 x…
Efficient thermal management is critical for ensuring the safety, performance, and durability of lithium ion pouch cells (LIPCs), particularly under high power operating conditions where conventional battery thermal management systems…