Related papers: Thermal Modeling of high power LED modules
Active thermal control is crucial in achieving the required accuracy and throughput in many industrial applications, e.g., in the medical industry, high-power lighting industry, and semiconductor industry. Thermoelectric Modules (TEMs) can…
Besides their electrical properties the optical parameters of LEDs also depend on junction temperature. For this reason thermal characterization and thermal management play important role in case of power LEDs, necessitating both physical…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
Power and thermal management are critical components of High-Performance-Computing (HPC) systems, due to their high power density and large total power consumption. The assessment of thermal dissipation by means of compact models directly…
Accurate and efficient thermal simulations of induction machines are indispensable for detecting thermal hot spots and hence avoiding potential material failure in an early design stage. A goal is the better utilization of the machines with…
Light Emitting Diodes emits no IR and no UV and their spectrum is fully in the visible part. But LEDs are not cold and all energy losses are thermal losses. The aim of this paper is to prove the feasibility to reuse the thermal losses to…
The ability of computational fluid dynamics (CFD) models to predict flow boiling at high heat flux and high flow velocity conditions has been investigated. High heat fluxes of about 10 MW/m 2 and high flow velocities of about 10 m/s…
Accurate temperature measurements are essential for the proper monitoring and control of industrial furnaces. However, measurement uncertainty is a risk for such a critical parameter. Certain instrumental and environmental errors must be…
Thermal emission is the radiation of electromagnetic waves from hot objects. The promise of thermal-emission engineering for applications in energy harvesting, radiative cooling, and thermal camouflage has recently led to renewed research…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
The present study proposes an optimized computational fluid dynamics (CFD) modelling framework to provide a complete and accurate representation of combustion and heat transfer phenomena in the radiation section of an industrial top-fired…
We discuss the theory and implementation of the finite temperature coupled cluster singles and doubles (FT-CCSD) method including the equations necessary for an efficient implementation of response properties. Numerical aspects of the…
In high-granularity calorimetry, as proposed for detectors at future Higgs factories, the requirements on electronics can have a strong impact on the design of the detector, especially via the cooling and acquisition systems. This project…
This note supplements a Reply [1] to a Comment [2] which identified a fundamental symmetry error we made in the original experimental study of a photon thermal diode [3]. For thermal specialists, here we provide some additional details…
Technological progress in electronics usually requires their use in increasingly aggressive environments, such as rapid thermal cycling and high power density. Thermal diodes appear as excellent candidates to thermally protect critical…
We demonstrate the capabilities of a high temperature measurement set-up recently developed at our institute. It is dedicated to the characterization of semiconductor devices and test structures in the temperature range from room…
In this paper we present the thermal and mechanical analysis of high-power light-emitting diodes (LEDs) with ceramic packages. Transient thermal measurements and thermo-mechanical simulation were performed to study the thermal and…
In order to identify the basic conditions for thermal rectification we investigate a simple model with non-uniform, graded mass distribution. The existence of thermal rectification is theoretically predicted and numerically confirmed,…
An innovative and accurate dynamic Compact Thermal Model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily…
The inter-temporal consumption flexibility of commercial buildings can be harnessed to improve the energy efficiency of buildings, or to provide ancillary service to the power grid. To do so, a predictive model of the building's thermal…