Related papers: Ultrafast Temperature Profile Calculation in Ic Ch…
Quantum computing raises the possibility of solving a variety of problems in physics that are presently intractable. A number of such problems involves the physics of systems in or near thermal equilibrium. There are two main ways to…
Radiative cooling is an important ingredient in hydrodynamical models involving evolution of high temperature plasmas. Unfortunately, calculating an accurate cooling coefficient generally requires the solution of over a hundred differential…
Heat transfer in semiconductor devices is dominated by chip and substrate assemblies, where heat generated within a finite chip layer dissipates into a semi-infinite substrate with much higher thermophysical properties. This mismatch…
The derivation of the effective temperature of a star is a critical first step in a detailed spectroscopic analysis. Spectroscopic methods suffer from systematic errors related to model simplifications. Photometric methods may be more…
Rapid heating of small buried regions by laser generated fast electrons may be useful for applications such as XUV radiation sources or as drivers for shock experiments. In non-structured targets the heating profile possesses a global…
This paper demonstrates the method of estimation of critical temperature Tc value of high-temperature superconductors from the dispersive part of AC susceptibility measurement using a pair of neural networks.
Monte Carlo simulations using entropic sampling to estimate the number of configurations of a given energy are a valuable alternative to traditional methods. We introduce {\it tomographic} entropic sampling, a scheme which uses multiple…
This paper presents a novel methodology for fast simulation and analysis of transient heat transfer. The proposed methodology is suitable for real-time applications owing to (i) establishing the solution method from the viewpoint of…
During thermal heating surgical procedures such as electrosurgery, thermal ablative treatment and hyperthermia, soft tissue deformation due to tool-tissue interaction and patients' motion can affect the distribution of induced thermal…
The junction temperature is a very important parameter for monitoring power electronics converters based on MOSFET transistors. They offer the possibility of switching at relatively higher frequencies than other transistors like IGTBTs.…
To determine the electron heat flux density on macroscopic scales, the most widely used approach is to solve a diffusion equation through a multi-group technique. This method is however restricted to transport induced by temperature…
With the current high levels of energy consumption of data centers, reducing power consumption by even a small percentage is beneficial. We propose a framework for thermal-aware workload distribution in a data center to reduce cooling power…
Graphics Processing Units (GPUs) are now powerful and flexible systems adapted and used for other purposes than graphics calculations (General Purpose computation on GPU -- GPGPU). We present here a prototype to be integrated into…
The standard particle-in-cell algorithm suffers from grid heating. There exists a gridless alternative which bypasses the deposition step and calculates each Fourier mode of the charge density directly from the particle positions. We show…
Rapid processes of heat transfer are not described by the standard heat conduction equation. To take into account a finite velocity of heat transfer, we use the hyperbolic model of heat conduction, which is connected with the relaxation of…
The study examines the heating profile of hot solar transition region loops, particularly focusing on transient brightenings observed in IRIS 1400{\AA} slit-jaw images. The findings challenge the adequacy of simplistic, singular heating…
In recent years, due to a higher demand for portable devices, which provide restricted amounts of processing capacity and battery power, the need for energy and time efficient hard- and software solutions has increased. Preliminary…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
This paper introduces a Bayesian inference framework for two-dimensional steady-state heat conduction, focusing on the estimation of unknown distributed heat sources in a thermally-conducting medium with uniform conductivity. The goal is to…
Thermal analysis provides deeper insights into electronic chips behavior under different temperature scenarios and enables faster design exploration. However, obtaining detailed and accurate thermal profile on chip is very time-consuming…