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Sputter thin film deposition after photolithography often produces unwanted spikes along the side edges. These spikes are a significant issue for the development of magnetic tunnel junction (MTJ)-based memory and molecular spintronics…
We present results of a planar process development based on the combination of electron-beam lithography and dry etching for fabricating high-quality superconducting photosensitive structures in the sub-100nm regime. The devices were…
Nanofabrication research pursues the miniaturization of patterned feature size. In the current state of the art, micron scale areas can be patterned with features down to ~ 30 nm pitch using electron beam lithography. Our work demonstrates…
Photo-induced synthesis and control over the size and shape of colloidal silver nanoparticles is investigated in contrast to photo-stimulated aggregation of small nanoparticles into large fractal-type structures. The feasibility of…
Silicon microelectronics, consisting of complementary metal oxide semiconductor (CMOS) technology, have changed nearly all aspects of human life from communication to transportation, entertainment, and healthcare. Despite the widespread and…
Hybrid nanophotonics based on metal-dielectric nanostructures unifies the advantages of plasmonics and all-dielectric nanophotonics providing strong localization of light, magnetic optical response and specifically designed scattering…
We explore the potential of 3D metal printing to realize complex conductive terahertz devices. Factors impacting performance such as printing resolution, surface roughness, oxidation, and material loss are investigated via analytical,…
With compact footprint, low energy consumption, high scalability, and mass producibility, chip-scale integrated devices are an indispensable part of modern technological change and development. Recent advances in two-dimensional (2D)…
Electron beams can acquire designed phase modulations by passing through nanostructured material phase plates. These phase modulations enable electron wavefront shaping and benefit electron microscopy, spectroscopy, lithography, and…
This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180 degrees C based on nickel plating and photoresist sacrificial layers. The advantages of…
Research in spintronics often involves generation of heat in nanoscale magnetic systems. This heat generation can be intentional, as when studying effects created by an external applied temperature difference, or unintentional, coming as a…
We demonstrate, for the first time, the applicability of 3D printing technique to the manufacture of scintillation detectors. We report of a formulation, usable in stereolithographic printing, that exhibits scintillation efficiency on the…
In this chapter we intend to discuss the major trends in the evolution of microelectronics and its eventual transition to nanoelectronics. As it is well known, there is a continuous exponential tendency of microelectronics towards…
High-speed Pockels modulation and second-order nonlinearities are key components in optical systems, but CMOS-compatible platforms like silicon and silicon nitride lack these capabilities. Micro-transfer printing of thin-film lithium…
Gallium-based liquid metals have recently been found important in a variety of newly emerging applications such as room temperature metal 3D printing, direct writing of electronics and biomedicine etc. In all these practices, one frequently…
Printed and flexible electronics (PFE) have emerged as the ubiquitous solution for application domains at the extreme edge, where the demands for low manufacturing and operational cost cannot be met by silicon-based computing. Built on…
In the last decades, digital manufacturing has constituted the headline of what is starting to be known as the 'fourth industrial revolution', where the fabrication processes comprise a hybrid of technologies that blur the lines between…
The electrical machinery core is formed with a ferromagnetic material that offers high magnetic properties. As ferromagnetic materials have high relative magnetic permeability, they are important in the formation of electromagnetic device…
Heat dissipation is one of the most serious problems in modern integrated electronics with the continuously decreasing devices size. Large portion of the consumed power is inevitably dissipated in the form of waste heat which not only…
Consumer-level multi-material 3D printing with conductive thermoplastics enables fabrication of interactive elements for bespoke tangible devices. However, large feature sizes, high resistance materials, and limitations of printable control…