Related papers: Design issues of a variable thermal resistance
We apply the muffin-tin effective medium approximation to calculate the temperature dependence of the resistivity and of the thermopower of amorphous and liquid metals. The results show unambiguously that a large resistivity is accompanied…
There is a useful counterpart of conformal prediction for e-values, called conformal e-prediction. Conformal prediction can serve as basis for testing the assumption of exchangeability, leading to conformal testing. Similarly, conformal…
This paper deals with the experimental evaluation of a roof-mounted multi-reflective radiant barrier (MRRB), installed according to the state of the art, on a dedicated test cell. An existing experimental device was completed with a…
Only about 1,000 qualitatively different protein folds are believed to exist in nature. Here, we review theoretical studies which suggest that some folds are intrinsically more designable than others, {\it i.e.} are lowest energy states of…
The problem of steady mixed convection boundary-layer flow on a cooled vertical permeable circular cylinder embedded in a fluid-saturated porous medium is studied. Here, we evaluate the flow and heat transfer characteristics numerically for…
Thermal management is an important challenge in modern electronics, avionics, automotive, and energy storage systems. While passive thermal solutions (like heat sinks or heat spreaders) are often used, actively modulating heat flow (e.g.…
The evolution of the power grid towards the so-called Smart Grid, where information technologies help improve the efficiency of electricity production, distribution and consumption, allows to use the fine-grained control brought by the…
Metamaterials offer a powerful way to manipulate a variety of physical fields ranging from wave fields (electromagnetic field, acoustic field, elastic wave, etc.), static fields (static magnetic field, static electric field) to diffusive…
As wide bandgap electronic devices have continued to advance in both size reduction and power handling capabilities, heat dissipation has become a significant concern. To mitigate this, chemical vapor deposited (CVD) diamond has been…
Two dimensional (2D) materials continue to hold great promise for future electronics, due to their atomic-scale thicknesses and wide range of tunable properties. However, commercial efforts in this field are relatively recent, and much…
V-telluride superlattice thin films have shown promising performance for on-chip cooling devices. Recent experimental studies have indicated that device performance is limited by the metal/semiconductor electrical contacts. One challenge in…
Recently, a temperature-sensitive long-range attraction colloidal system exhibiting melting and pre-melting of colloidal crystals has been reported by Li et al.[1]. If it is true, it would be an ideal system to simulate a board range of…
The tremendous amount of wasted heat from solar radiation and industry dissipation has motivated the development of thermoelectric concepts that directly convert heat into electricity. The main challenge in practical applications for…
A programmable linear resistor with a compact footprint would have profound implications for microelectronics, enabling efficient in-sensor analog signal processing and in-memory computing. Non-volatile memory offers a potential solution…
Tactile sensation is essential for humans to recognize objects. Various devices have been developed in the past for tactile presentation by electrostatic force, which are easy to configure devices, but there is currently no such device that…
Rocks are important examples for solid materials where, in various engineering situations, elastic, thermal expansion, rheological/viscoelastic and plastic phenomena each may play a remarkable role. Nonequilibrium continuum thermodynamics…
Environmentally-powered computer systems operate on renewable energy harvested from their environment, such as solar or wind, and stored in batteries. While harvesting environmental energy has long been necessary for small-scale embedded…
As CMOS technology scales down, thermal fluctuations increasingly impact circuit behavior, posing challenges to conventional circuit design. However, the inherent stochasticity introduced by thermal noise is now being explored as a…
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical…
We present a thermal rectification device concept based on far-field radiative exchange between two selective emitters. Rectification is achieved due to the fact that one of the selective emitters radiative properties are independent on…