Related papers: Design issues of a variable thermal resistance
It is up to now a challenge to control the conduction of heat. Here we develop a method to distort the temperature distribution signature of an object at will. As a result, the object accurately exhibits the same temperature distribution…
Purpose of Review: As new technological advancements are made, humanoid robots that utilise them are being designed and manufactured. For optimal design choices, a broad overview with insight on the advantages and disadvantages of available…
This paper presents a study of accuracy issues in thermal modeling of high power LED modules on system level. Both physical as well as numerical accuracy issues are addressed. Incorrect physical assumptions may result in seemingly correct,…
Thermal emission is the radiation of electromagnetic waves from hot objects. The promise of thermal-emission engineering for applications in energy harvesting, radiative cooling, and thermal camouflage has recently led to renewed research…
The correct evaluation of a material property is fundamental to, on their application; they met all expectations that were designed for. In development of an expansive cement for ornamental rocks purpose, was denoted the absence of…
The thermal resistance associated with the interface between a solid and a liquid is analyzed from an atomistic point of view. Partial evaluation of the associated Green-Kubo integral elucidates the various factors governing heat transport…
This paper proposes an inverse design scheme for resistive heaters. By adjusting the spatial distribution of a binary electrical resistivity map, the scheme enables objective-driven optimization of heaters to achieve pre-defined…
A growing number of wearable devices is becoming increasingly non-invasive, readily available, and versatile for measuring different physiological signals. This renders them ideal for inferring the emotional states of their users. Despite…
The designers pre-occupation to reduce energy consumption and to achieve better thermal ambience levels, has favoured the setting up of numerous building thermal dynamic simulation programs. The progress in the modelling of phenomenas and…
Quantitative descriptions of the structure-thermal property correlation have been a bottleneck in designing materials with superb thermal properties. In the past decade, the first-principles phonon calculations using density functional…
Thermal behavior has become a first-order constraint in advanced 2.5D/3D integrated circuits (ICs) and heterogeneous packages. As power densities rise and multiple active dies are vertically integrated, heat removal paths become…
Prognostics is a process of assessing the extent of deviation or degradation of a product from its expected normal operating condition, and then, based on continuous monitoring, predicting the future reliability of the product. By being…
Optimizing a building's energy supply design is a task with multiple competing criteria, where not only monetary but also, for example, an environmental objective shall be taken into account. Moreover, when deciding which storages and…
A new formulation of physical thermal models for variable plug flow through a pipe is proposed. The derived model is based on a commonly used one-dimensional distributed parameter model, which explicitly takes into account the heat capacity…
Well-established textbook arguments suggest that static electric susceptibility must be positive in "all bodies" [1]. However, it has been pointed out that media that are not in thermodynamic equilibrium are not necessarily subject to this…
New inventions change the approach of vacuum suitable welding for research purpose. With orbital welding, laser welding and robot welding the possibilities increase to fabricate larger vessels more accurately. Despite this development there…
A variational approach is employed to find stationary solutions to a free boundary problem modeling an idealized electrostatically actuated MEMS device made of an elastic plate coated with a thin dielectric film and suspended above a rigid…
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design…
The response of electric devices to an applied thermal gradient has, so far, been studied almost exclusively in two-terminal devices. Here we present measurements of the response to a thermal bias of a four-terminal, quasi-ballistic…
This paper analyzes a transient method for the characterization of low-resistance thermal interfaces of microelectronic packages. The transient method can yield additional information about the package not available with traditional static…