English

Thermoelastic surface acoustic waves in low-loss silicon nitride integrated circuits

Optics 2026-02-09 v1

Abstract

Acousto-optic modulation in photonic integrated circuits harness the applications that include signal processing, quantum photonics and microwave photonics. However, silicon nitride (Si3N4\rm{Si_3N_4}), as a main-stream low-loss scalable photonic platform, suffers from the lack of piezoelectric effect and therefore the hybrid co-integration with other materials is always required for acousto-optic modulation. Here, we employed thermoelastic surface acoustic waves (SAW) in a 8 dB/m propagation loss Si3N4\rm{Si_3N_4} integrated circuits without adding extra materials. A phase modulation efficiency enhancement of 13.6 dB is realized with a multi-pass configuration. Furthermore, a single-sideband intermodal scattering with a suppression ratio of 8 dB is measured and an intensity modulation is observed by incorporating the phase modulation into a ring resonator spectral. This thermoelastic SAW technique, as an initial step of acousto-optic modulation in low-loss Si3N4\rm{Si_3N_4} platform, is promising for integrated microwave photonics and programmable photonics applications.

Keywords

Cite

@article{arxiv.2602.06732,
  title  = {Thermoelastic surface acoustic waves in low-loss silicon nitride integrated circuits},
  author = {Zheng Zheng and Ahmet Tarık Işık and Akshay Keloth and Kaixuan Ye and Peter van der Slot and David Marpaung},
  journal= {arXiv preprint arXiv:2602.06732},
  year   = {2026}
}
R2 v1 2026-07-01T10:24:30.254Z