English

Thermal Conductivity of Thermally-Isolating Polymeric and Composite Structural Support Materials Between 0.3 and 4 K

Astrophysics 2008-08-14 v1 Instrumentation and Detectors

Abstract

We present measurements of the low-temperature thermal conductivity of a number of polymeric and composite materials from 0.3 to 4 K. The materials measured are Vespel SP-1, Vespel SP-22, unfilled PEEK, 30% carbon fiber-filled PEEK, 30% glass-filled PEEK, carbon fiber Graphlite composite rod, Torlon 4301, G-10/FR-4 fiberglass, pultruded fiberglass composite, Macor ceramic, and graphite rod. These materials have moderate to high elastic moduli making them useful for thermally-isolating structural supports.

Keywords

Cite

@article{arxiv.0806.1921,
  title  = {Thermal Conductivity of Thermally-Isolating Polymeric and Composite Structural Support Materials Between 0.3 and 4 K},
  author = {M. C. Runyan and W. C. Jones},
  journal= {arXiv preprint arXiv:0806.1921},
  year   = {2008}
}

Comments

Accepted for publication in the journal Cryogenics