Surface Modifications of PCB-Based Plasma Sources Induced by Atmospheric Plasma: A Comparative Study of Dielectric and Electrode Materials
Abstract
The study investigated the effects of atmospheric plasma on various dielectric materials (FR-4, PTFE, AlO) and electrode materials (copper, silver, gold-plated copper) used in surface micro-discharge plasma sources. XPS and laser microscopy were used to analyze changes in surface properties and chemical composition after 10 hours of plasma exposure. AlO showed the highest resistance, with no significant changes in Al/O ratio or oxidation state. PTFE underwent oxidation, with fluorine substituted by oxygen, forming carbonyl, hydroxyl and aldehyde groups. FR-4 showed the most substantial changes, with etching of the epoxy matrix exposing glass fibers. This was in line with the XPS results, which show a higher O/C-ratio, less epoxy groups and higher nitrogen signals. Silver electrodes were most resilient, with sintered particles redistributed across the AlO surface. Copper and gold-plated copper electrodes were more susceptible to oxidation and degradation, especially in areas exposed to plasma filaments. The results highlight the importance of carefully selecting materials based on resistance to plasma exposure and compatibility with the application.
Keywords
Cite
@article{arxiv.2410.16751,
title = {Surface Modifications of PCB-Based Plasma Sources Induced by Atmospheric Plasma: A Comparative Study of Dielectric and Electrode Materials},
author = {Jonathan Gail and Alisa Schmidt and Markus H. Thoma},
journal= {arXiv preprint arXiv:2410.16751},
year = {2024}
}