Snap-Through Thermomechanical Metamaterials for High-Performance Thermal Rectification
Abstract
Thermal diodes that enable directional heat transport are essential for advanced thermal management in microelectronics, energy systems, and thermal logic devices. However, existing designs based on phase-change materials, nanostructures, or interfacial engineering suffer from limited rectification performance, configurational inflexibility, and poor scalability. Here, we present a thermomechanical metamaterial-based thermal diode that combines temperature-responsive actuation with structural bistability to achieve high-efficiency, nonreciprocal thermal transport. The device integrates shape memory alloy (SMA) springs with pre-buckled copper strips that undergo snap-through transitions in response to thermal gradients. This reconfiguration enables contact-based conduction in the forward mode and suppresses reverse heat flow via radiative isolation. We develop a coupled analytical model combining Euler-Bernoulli beam theory and a thermal resistance network, and validate the system through finite element (FE) simulations and experiments. The device achieves a thermal rectification ratio exceeding 900, with robust cycling stability and structural integrity. A modular stacking strategy further enhances scalability without compromising performance. This work establishes a new design framework for high-performance, passive thermal rectifiers that bridge mechanical metamaterials and advanced thermal engineering.
Cite
@article{arxiv.2506.23489,
title = {Snap-Through Thermomechanical Metamaterials for High-Performance Thermal Rectification},
author = {Qinyun Ding and Yuhao Wang and Guanqing Xiong and Wei Chen and Ying Chen and Zhaoguang Wang and Arup Neogi and Jaehyung Ju},
journal= {arXiv preprint arXiv:2506.23489},
year = {2025}
}