A phase field method self-consistently coupled to continuum heat transport and charge conservation is used to simulate conducting filament dynamical evolution and nanostructure of electroformed resistive switching thin films. Our method does not require a pre-defined idealized conducting filament, as previous methods do, instead treating its dynamical evolution as a stochastic diffuse interface problem subject to a variational principle. Our simulation results agree well with available experimental observations, correctly reproducing electroformed conducting filament nanostructure exhibited by a variety of resistive switching thin films.
@article{arxiv.2307.14582,
title = {Resistive Switching Conducting Filament Electroformation with an Electrothermal Phase Field Method},
author = {John F. Sevic and Nobuhiko P. Kobayashi},
journal= {arXiv preprint arXiv:2307.14582},
year = {2023}
}