English

Negative thermal expansion and metallophilicity in Cu$_3$[Co(CN)$_6$]

Materials Science 2018-03-14 v1

Abstract

We report the synthesis and structural characterisation of the molecular framework copper(I) hexacyanocobaltate(III), Cu3_3[Co(CN)6_6], which we find to be isostructural to H3_3[Co(CN)6_6] and the colossal negative thermal expansion material Ag3_3[Co(CN)6_6]. Using synchrotron X-ray powder diffraction measurements, we find strong positive and negative thermal expansion behaviour respectively perpendicular and parallel to the trigonal crystal axis: αa\alpha_a = 25.4(5)\,MK1^{-1} and αc\alpha_c = -43.5(8)\,MK1^{-1}. These opposing effects collectively result in a volume expansivity αV\alpha_V = 7.4(11)\,MK1^{-1} that is remarkably small for an anisotropic molecular framework. This thermal response is discussed in the context of the behaviour of the analogous H- and Ag-containing systems. We make use of density-functional theory with many-body dispersion interactions (DFT+MBD) to demonstrate that Cu\ldotsCu metallophilic (`cuprophilic') interactions are significantly weaker in Cu3_3[Co(CN)6_6] than Ag\ldotsAg interactions in Ag3_3[Co(CN)6_6], but that this lowering of energy scale counterintuitively translates to a more moderate---rather than enhanced---degree of structural flexibility. The same conclusion is drawn from consideration of a simple lattice dynamical model, which we also present here. Our results demonstrate that strong interactions can actually be exploited in the design of ultra-responsive materials if those interactions are set up to act in tension.

Keywords

Cite

@article{arxiv.1702.07133,
  title  = {Negative thermal expansion and metallophilicity in Cu$_3$[Co(CN)$_6$]},
  author = {Adam F. Sapnik and Xiaofei Liu and Hanna L. B. Boström and Chloe S. Coates and Alistair R. Overy and Emily M. Reynolds and Alexandre Tkatchenko and Andrew L. Goodwin},
  journal= {arXiv preprint arXiv:1702.07133},
  year   = {2018}
}

Comments

10 pages, 9 figures