Modeling of Deformation and Texture Development of Copper in a 120° ECAE Die
Materials Science
2012-05-15 v1
Abstract
A flow line function is proposed to describe the material deformation in ECAE for a 120\degree die. This new analytical approach is incorporated into a viscoplastic self-consistent polycrystal code to simulate the texture evolution in Route A of copper and compared to experimental textures as well as to those corresponding to simple shear.
Keywords
Cite
@article{arxiv.1205.2745,
title = {Modeling of Deformation and Texture Development of Copper in a 120° ECAE Die},
author = {Roxane Arruffat Massion and L. S. Toth and Jean-Philippe Mathieu},
journal= {arXiv preprint arXiv:1205.2745},
year = {2012}
}