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Mechanical Fatigue on Gold MEMS Devices: Experimental Results

Other Computer Science 2008-12-18 v1

Abstract

The effect of mechanical fatigue on structural performances of gold devices is investigated. The pull-in voltage of special testing micro-systems is monitored during the cyclical load application. The mechanical collapse is identified as a dramatic loss of mechanical strength of the specimen. The fatigue limit is estimated through the stair-case method by means of the pull-in voltage measurements. Measurements are performed by means of the optical interferometric technique.

Keywords

Cite

@article{arxiv.0805.0945,
  title  = {Mechanical Fatigue on Gold MEMS Devices: Experimental Results},
  author = {Giorgio De Pasquale and Aurelio Somà and Alberto Ballestra},
  journal= {arXiv preprint arXiv:0805.0945},
  year   = {2008}
}

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Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)