Computed Laminography (CL) is a key non-destructive testing technology for the visualization of internal structures in large planar objects. The inherent scanning geometry of CL inevitably results in inter-layer aliasing artifacts, limiting its practical application, particularly in electronic component inspection. While deep learning (DL) provides a powerful paradigm for artifact removal, its effectiveness is often limited by the domain gap between synthetic data and real-world data. In this work, we present LaminoDiff, a framework to integrate a diffusion model with a high-fidelity prior representation to bridge the domain gap in CL imaging. This prior, generated via a dual-modal CT-CL fusion strategy, is integrated into the proposed network as a conditional constraint. This integration ensures high-precision preservation of circuit structures and geometric fidelity while suppressing artifacts. Extensive experiments on both simulated and real PCB datasets demonstrate that LaminoDiff achieves high-fidelity reconstruction with competitive performance in artifact suppression and detail recovery. More importantly, the results facilitate reliable automated defect recognition.
@article{arxiv.2601.07254,
title = {LaminoDiff: Artifact-Free Computed Laminography in Non-Destructive Testing via Diffusion Model},
author = {Tan Liu and Liu Shi and Binghuang Peng and Tong Jia and Xiaoling Xu and Baodong Liu and Qiegen Liu},
journal= {arXiv preprint arXiv:2601.07254},
year = {2026}
}