Understanding the local fracture resistance of microstructural features. such as brittle inclusions, coatings, and interfaces at the microscale under complex loading conditions is critical for microstructure-informed design of materials. In this study, a novel approach has been formulated to decompose the J-integral evaluation of the elastic energy release rate to the three-dimensional stress intensity factors directly from experimental measurements of the elastic deformation gradient tensors of the crack field by in situ high (angular) resolution electron backscatter diffraction (HR-EBSD). An exemplar study is presented of a quasi-static crack, inclined to the observed surface, propagating on low index {hkl} planes in a (001) single crystal silicon wafer.
@article{arxiv.2206.10243,
title = {HR-EBSD analysis of in situ stable crack growth at the micron scale},
author = {Abdalrhaman Koko and Thorsten H. Becker and Elsiddig Elmukashfi and Nicola M. Pugno and Angus J. Wilkinson and T. James Marrow},
journal= {arXiv preprint arXiv:2206.10243},
year = {2023}
}