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Grain-Resolved Temperature-Dependent Anisotropy in Hexagonal Ti-7Al Revealed by Synchrotron X-Ray Diffraction

Materials Science 2020-06-02 v1

Abstract

Hexagonal metals have anisotropic coefficients of thermal expansion causing grain-level internal stresses during heating. High energy x-ray diffraction microscopy, a non-destructive, in situ, micromechanical and microstructural characterization technique, has been used to determine the anisotropic coefficients of thermal expansion (CTEs) for Ti-7Al. Two samples of polycrystalline α\alpha-phase Ti-7Al were continuously heated from room temperature to 850 ^\circC while far-field HEDM scans were collected. The results showed a change in the ratio of the CTEs in the 'a' and 'c' directions which explains discrepancies found in the literature. The CTE additionally appears to be affected by the dissolution of α2\alpha_2 precipitates. Analysis of the grain-resolved micromechanical data also shows reconfiguration of the grain scale stresses likely due to anisotropic expansion driving crystallographic slip.

Keywords

Cite

@article{arxiv.2006.00065,
  title  = {Grain-Resolved Temperature-Dependent Anisotropy in Hexagonal Ti-7Al Revealed by Synchrotron X-Ray Diffraction},
  author = {Rachel E. Lim and Darren C. Pagan and Donald E. Boyce and Joel V. Bernier and Paul A. Shade and Anthony D. Rollett},
  journal= {arXiv preprint arXiv:2006.00065},
  year   = {2020}
}

Comments

22 pages, 12 figures, Submitted for peer review

R2 v1 2026-06-23T15:55:12.190Z