English

Fast Diffusion Mechanism of Silicon Tri-interstitial Defects

Materials Science 2009-11-11 v2

Abstract

We reveal the microscopic self-diffusion process of compact tri-interstitials in silicon using a combination of molecular dynamics and nudged elastic band methods. We find that the compact tri-interstitial moves by a collective displacement, involving both translation and rotation, of five atoms in a screw-like motion along [111][111] directions. The elucidation of this pathway demonstrates the utility of combining tight-binding molecular dynamics with \textit{ab initio} density functional calculations to probe diffusion mechanisms. Using density functional theory to obtain diffusion barriers and the prefactor, we calculate a diffusion constant of 4105exp(0.49eV/kBT)cm2/s 4 \cdot 10^{-5} \exp (- 0.49 {\rm eV} / k_{B} T) {\rm cm^2/s} . Because of the low diffusion barrier, I3bI_{3}^{b} diffusion may be an important process under conditions such as ion implantation that creates excess interstitials, hence favoring formation of interstitial clusters.

Keywords

Cite

@article{arxiv.cond-mat/0503479,
  title  = {Fast Diffusion Mechanism of Silicon Tri-interstitial Defects},
  author = {Yaojun A. Du and Stephen A. Barr and Kaden R. A. Hazzard and Thomas J. Lenosky and Richard G. Hennig and John W. Wilkins},
  journal= {arXiv preprint arXiv:cond-mat/0503479},
  year   = {2009}
}
R2 v1 2026-07-22T11:15:02.314Z