Development of EHD Ion-Drag Micropump for Microscale Electronics Cooling Systems
Abstract
In this investigation, the numerical simulation of electrohydrodynamic (EHD) ion-drag micropumps with micropillar electrode geometries have been performed. The effect of micropillar height and electrode spacing on the performance of the micropumps was investigated. The performance of the EHD micropump improved with increased applied voltage and decreased electrode spacing. The optimum micropillar height for the micropump with electrode spacing of 40m and channel height of 100m at 200V was 40m, where a maximum mass flow rate of 0.18g/min was predicted. Compared to that of planar electrodes, the 3D micropillar electrode geometry enhanced the overall performance of the EHD micropumps.
Cite
@article{arxiv.0801.1001,
title = {Development of EHD Ion-Drag Micropump for Microscale Electronics Cooling Systems},
author = {C. K. Lee and A. J. Robinson and C. Y. Ching},
journal= {arXiv preprint arXiv:0801.1001},
year = {2008}
}
Comments
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)