Desiccation of a clay film: Cracking versus peeling
Soft Condensed Matter
2009-11-13 v1 Disordered Systems and Neural Networks
Abstract
Cracking and peeling of a layer of clay on desiccation has been simulated using a spring model. A vertical section through the layer with finite thickness is represented by a rectangular array of nodes connected by linear springs on a square lattice. The effect of reduction of the natural length of the springs, which mimics the drying is studied. Varying the strength of adhesion between sample and substrate and the rate of penetration of the drying front produces an interesting phase diagram, showing cross-over from peeling to cracking behavior. Changes in the number and width of cracks on varying the layer thickness is observed to reproduce experimental reports.
Cite
@article{arxiv.0805.2779,
title = {Desiccation of a clay film: Cracking versus peeling},
author = {Supti Sadhukhan and Janett Prehl and Peter Blaudeck and K. H. Hoffmann and Tapati Dutta and Sujata Tarafdar},
journal= {arXiv preprint arXiv:0805.2779},
year = {2009}
}
Comments
4 figures