The thermal management have been widely focused due to broad applications. Generally, the deformation can largely tune the thermal transport. The main challenge of flexible electronics/ materials is to maintain thermal conductance under large deformation. This work investigates the thermal conductance of a nano-designed Si metamaterial constructed with curved nanobeams by molecular dynamics simulation. Interestingly, it shows that the thermal conductance of the nano-designed Si metamaterial is insensitive under a large deformation (strain~-41%). The new feature comes from the designed curved nanobeams which makes a quasi-zero stiffness. Further calculations show that, when under a large deformation, the average stress in nanobeam is ultra-small (<151 MPa) and its phonon density of states are little changed. This work provides valuable insights on multifunction, such as both stable thermal and mechanical properties, of nano-designed metamaterials.
@article{arxiv.2210.13806,
title = {Deformation insensitive thermal conductance of the designed Si metamaterial},
author = {Lina Yang and Quan Zhang and Gengkai Hu and Nuo Yang},
journal= {arXiv preprint arXiv:2210.13806},
year = {2023}
}