Circuit-Level Design, Modeling, and On-Wafer Characterization of a Coplanar THz Optoelectronic Mixer
Abstract
We report the design, modeling, and on-wafer characterization of a photoconductive heterodyne mixer implemented as a true terahertz monolithic integrated circuit (TMIC). Unlike previous photoconductive heterodyne demonstrations, the proposed circuit is characterized using RF integrated circuit metrics including input return loss, RF/IF isolation, broadband impedance matching, and conversion loss. The mixer combines a microcavity photoconductor with a broadband coplanar matching network incorporating a Ti shunt resistor, an RF DC-blocking MIM capacitor, and an RF/IF decoupling capacitor. A circuit-level model including both the photoconductor and the distributed CPW accesses is developed and validated. The passive circuit is experimentally characterized up to 500 GHz using on-wafer VNA measurements and accurately reproduced by simulation. Under illumination, the model predicts an input reflection coefficient below -10 dB up to 215 GHz and better than -6.5 dB up to 500 GHz. Measured and simulated conversion losses agree within +/-1 dB over the entire 1-500 GHz range. Conversion loss varies from 22.5-25.5 dB below 320 GHz and 26-34 dB up to 500 GHz. The proposed TMIC demonstrates broadband operation and provides a validated circuit design methodology for future integrated THz photonic mixers.
Keywords
Cite
@article{arxiv.2608.03768,
title = {Circuit-Level Design, Modeling, and On-Wafer Characterization of a Coplanar THz Optoelectronic Mixer},
author = {S. Islam and V. Merupo and C. Chamek and M. Sassi and C. Coinon and Y. Deblock and E. Okada and S. Lepilliet and F. Braud and Q. Fornasiero and G. Di Gioia and M. Faucher and G. Ducournau and G. Loas and S. Arscott and E. Peytavit},
journal= {arXiv preprint arXiv:2608.03768},
year = {2026}
}
Comments
Submitted to IEEE Transactions on Terahertz Science and Technology. 11 pages, 11 figures