Advances in All-Silicon Waveguides for Terahertz Integration
Abstract
In chip-to-chip communication, terahertz waves provide a promising approach to achieve high data capacity with improved energy efficiency, effectively bridging the gap between electrical and optical domains. By realizing this potential, all-dielectric waveguides have emerged as high-speed interconnects, offering broad bandwidth and low-loss characteristics while being compatible with planar integration. This paper reviews different types of terahertz all-dielectric waveguides, including photonic-crystal and effective-medium-clad structures, and highlights recent progress in implementing these platforms to develop various passive functional devices, paving the way for high-speed operation and large-scale integration in terahertz systems.
Cite
@article{arxiv.2601.08515,
title = {Advances in All-Silicon Waveguides for Terahertz Integration},
author = {Nguyen H. Ngo and Weijie Gao and Masayuki Fujita},
journal= {arXiv preprint arXiv:2601.08515},
year = {2026}
}
Comments
Presented and published (https://ken.ieice.org/ken/paper/20251216ocP1/eng/)