English

Advanced Compact Thermal Modeling by using VHDL-AMS

Materials Science 2007-09-13 v1

Abstract

This paper presents an improved methodology to generate Compact Thermal Models "CTMs" by using (VHDL-AMS) modeling language. This methodology makes it possible to have Boundary Conditions Independent "BCI" CTMs for multi chip components and systems while taking into account the nonlinear thermal conductivity of semiconductors and other materials.

Cite

@article{arxiv.0709.1830,
  title  = {Advanced Compact Thermal Modeling by using VHDL-AMS},
  author = {W. Habra and P. Tounsi and J. -M. Dorkel},
  journal= {arXiv preprint arXiv:0709.1830},
  year   = {2007}
}

Comments

Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

R2 v1 2026-06-21T09:16:43.071Z