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A Via-less Fully Screen-Printed Reconfigurable Intelligent Surface for 5G Millimeter Wave Communication

Signal Processing 2023-02-08 v1

Abstract

In this paper, we propose a via-less fully screen-printed reconfigurable intelligent surface which can establish a second line-of-sight communication from 23.5GHz to 29.5GHz. By serially connecting the H shaped resonator along the H field of the incident wave, we minimize the effect of the biasing lines and make a via-less design, which reduces the fabrication difficulty and cost. The unit-cell simulation of the array with screen-printed VO2 switches shows a 215{\deg} to 160{\deg} phase shift difference between the ON and OFF states within bandwidth. During the field testing of the ideal arrays, we verify that the array can redirect the 45{\deg} incident wave to 0{\deg} reflection with a signal enhancement of at least 10 dB as compared to the array which has all unit cells in the OFF condition.

Keywords

Cite

@article{arxiv.2302.03424,
  title  = {A Via-less Fully Screen-Printed Reconfigurable Intelligent Surface for 5G Millimeter Wave Communication},
  author = {Yiming Yang and Ruiqi Wang and Mohammad Vaseem and Behrooz Makki and Atif Shamim},
  journal= {arXiv preprint arXiv:2302.03424},
  year   = {2023}
}

Comments

2 pages, 3 figures, submitted to 2023 IEEE International Symposium on Antennas and Propagation