A possible solution of the grain boundary problem for applications of high-Tc superconductors

G. Hammerl; A. Herrnberger; A. Schmehl; A. Weber; K. Wiedenmann; C. W. Schneider; J. Mannhart

doi:10.1063/1.1516831

A possible solution of the grain boundary problem for applications of high-Tc superconductors

Superconductivity 2009-11-07 v1

Authors: G. Hammerl , A. Herrnberger , A. Schmehl , A. Weber , K. Wiedenmann , C. W. Schneider , J. Mannhart

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Abstract

It is shown that the critical current density of high-Tc wires can be greatly enhanced by using a threefold approach, which consists of grain alignment, doping, and optimization of the grain architecture. According to model calculations, current densities of 4x10^6 A/cm2 can be achieved for an average grain alignment of 10 degree at 77K. Based on this approach, a road to competitive high-Tc cables is proposed.

Keywords

high-Tc superconductors grain boundary critical current density grain alignment doping grain architecture

Cite

@article{arxiv.cond-mat/0208253,
  title  = {A possible solution of the grain boundary problem for applications of high-Tc superconductors},
  author = {G. Hammerl and A. Herrnberger and A. Schmehl and A. Weber and K. Wiedenmann and C. W. Schneider and J. Mannhart},
  journal= {arXiv preprint arXiv:cond-mat/0208253},
  year   = {2009}
}

Comments

3 pages, 5 figures

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