SnBiInZn based high entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 oC. The wetting angle is about 52o after reflow at 100 oC for 10 min. The interfacial intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol, however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for bio-medical devices.
@article{arxiv.2006.01345,
title = {A high entropy alloy as very low melting point solder for advanced electronic packaging},
author = {Yingxia Liua and Li Pu and Yong Yang and Quanfeng He and Ziqing Zhou and Chengwen Tan and Xiuchen Zhao and Qingshan Zhang and K. N. Tu},
journal= {arXiv preprint arXiv:2006.01345},
year = {2020}
}